发明名称 LASER TRIMMING OF CHIP RESISTORS
摘要 <p>PURPOSE:To provide a laser trimming method of chip resistors which simplifies alignment of laser irradiation position and perfectly eliminates generation of intermediate interruption or interruption at both ends by displacement of the printing in a laser trimming apparatus by setting a separation line for break provided at the center of a couple of chip resistance elements as the initial point of laser trimming process of respective chip resistance elements. CONSTITUTION:Adjacent two chip resistance elements 1, 1a are paired through a separating line 3 for break in a laser trimming method of chip resistors to conduct compensation of resistance value with a laser trimming apparatus for many chip resistance elements formed by the printing on a ceramic substrate 4 via a separating line 3 for break. The laser trimming process of a pair of two chip resistor elements 1, 1a is conducted by starting irradiation of laser at the initial point of separating line 3 for break.</p>
申请公布号 JPH04322404(A) 申请公布日期 1992.11.12
申请号 JP19910090664 申请日期 1991.04.22
申请人 ROHM CO LTD 发明人 ONO SEIYA;OGURO TAKAO
分类号 H01C7/00;H01C17/24;H01C17/242 主分类号 H01C7/00
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