发明名称 |
METHOD FOR MEASURING THICKNESS OF SILYLATED RESIST LAYER |
摘要 |
PURPOSE:To provide a method for measuring a thickness of a silylated resist layer for enabling a thickness of hte silylated resist layer to be measured easily before development. CONSTITUTION:A resist layer on a substrate is exposed by using a mask in a specific pattern, infrared rays are emitted to a resist layer with a silylated layer which is formed at an exposure region by silylutin to obtain absorption strength ratios of 874cm<-1> and 1594cm<-1> and then a thickness of the silylutin layer is measured by using a calibration curve of the absorption strength ratio and the thickness of the silylated layer which are produced previously. |
申请公布号 |
JPH04320321(A) |
申请公布日期 |
1992.11.11 |
申请号 |
JP19910088722 |
申请日期 |
1991.04.19 |
申请人 |
SHARP CORP |
发明人 |
TANIMOTO KEISUKE;TAKEHARA DAISUKE |
分类号 |
G01B11/06;G03F7/26;H01L21/027;H01L21/30 |
主分类号 |
G01B11/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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