| 摘要 |
<p>PURPOSE:To present a semiconductor device that prevents a drip of a chemical from the end face of a wafer, by dispensing an encapsulating chemcial automatically onto the end face of the wafer so that a uniform face of an applied chemical is obtained. CONSTITUTION:A semiconductor manufacturing apparatus comprises an adjustment mechanism 3 for adjusting the horizontal location of a semiconductor wafer 7, a wafer chuck mechanism 8 for holding horizontally the semiconductor wafer 7, a mechanism 12 for turning the wafer chuck mechanism 8 and moving the semiconductor wafer 7 to an adequate position where the encapsulating chemical is applied, a driving mechanism 9 for turning the semiconductor device 7 through the wafer chuck mechanism 8, and a dispenser unit 33 for dispensing an encapsulating chemical to the end face of the semiconductor wafer 7, which has been turned through the driving mechanism 9, so that an encapsulating chemical is applied automatically to the end face of the semiconductor device 7.</p> |
