| 摘要 |
A microwave circuit high isolation packaging technology involving the fabrication of a single-piece baseplate containing microwave circuits, the fabrication of a single-piece framework, and the assembly of the baseplate structure to the framework structure eliminating any gaps. The baseplate contains the desired microwave circuitry without isolation channels or other impediments to mounting circuit components or making circuit interconnections. The framework comprises all isolation walls, transoms, or other structures capable of isolating individual portions of the microwave circuit when assembled to the baseplate.
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