发明名称 SOLDERING DEVICE
摘要 PURPOSE:To execute the soldering so that an undesirable influence caused by heat is not generated in other part than a ferromagnetic material, for instance, a mount base plate, etc. CONSTITUTION:The device is provided with an electromagnetic induction heating part 7, and executes soldering by executing electromagnetic induction heating to a ferromagnetic material part and melting cream solder 5 given in advance to the part concerned in a state that a member 1 to be soldered is placed on the electromagnetic induction part. Since only the ferromagnetic material part is heated, an undesirable influence caused by heat does not exert on other part than the part.
申请公布号 JPH04309458(A) 申请公布日期 1992.11.02
申请号 JP19910099759 申请日期 1991.04.05
申请人 SONY CORP 发明人 YOSHIKAWA SHIGEAKI
分类号 B23K3/04;H05B6/12 主分类号 B23K3/04
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