发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To provide a method for manufacturing a semiconductor device in which the area of a cell is reduced and a large scale integration is possible. CONSTITUTION:In order to mold a first conductor film 13 for constituting a storage node 12 by etching, it is etched with a cylinder of a second conductor film 16 for similarly constituting the node 12 as a mask. Thus, since it is not necessary to provide an aligning margin, the area of a capacitor can be reduced.
申请公布号 JPH04304671(A) 申请公布日期 1992.10.28
申请号 JP19910092621 申请日期 1991.04.01
申请人 TOSHIBA CORP 发明人 KISHI KOICHI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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