| 摘要 |
PURPOSE:To obtain the title circuit substrate capable of being burnt in an integrated way with a conductive material free from warpage and delamination by making a dielectric material composition for low-temperature burning comprising an insulating layer composed of glass-ceramics composite material and a dielectric layer composed of BaTiO3-based ceramics, etc. CONSTITUTION:Ceramics (e.g. alumina) is blended with glass (e.g. borosilicate glass) in a weight ratio of 1:9-7:3, kneaded with a binder, etc., to give a slurry, which is cast into a carrier film to make a green sheet. A via hole is formed on the sheet and a copper paste is cast into the hole. A print pattern is formed with the copper paste on the surface. On the other hand, a Li salt compound (e.g. lithium carbonate) and glass (e.g. borosilicate glass) are added to BaTiO3 to similarly prepare a green sheet. The above-mentioned two green sheets are joined together in position, laminated, burnt in a N2 atmosphere at about 1,000 deg.C and finally a coating film of glass is formed on the side of the substrate to give the title circuit substrate. |
