| 摘要 |
PURPOSE:To increase the mount density, to avoid mutual interference and to make the device small by providing a high frequency circuit to one side of a board in which a conductor layer is provided between dielectric layers and providing a low frequency circuit and a power supply circuit to the other side. CONSTITUTION:A board B is so structured that a conductor layer E is provided between dielectric layers D1 and D2. A high frequency circuit H consisting of components h1, h2 comprising active components such as a field effect transistor(TR) and a diode and a passive component such as a resistor and a capacitor is arranged to an upper side of the board B. Moreover, a low frequency and DC circuit L consisting of active and passive components I1-I3 such as a TR, a diode, a resistor and a capacitor is arranged to the lower side of the board B. Since components of an amplifier section and a power supply section are independently arranged to both sides of the board B, then both the sides of the board B are utilized, and the mutual interference between the high frequency circuit H and the low frequency and DC circuit L is prevented by connecting the conductor layer E to ground. |
