发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE LEAD FRAME
摘要 PURPOSE:To obtain a lead frame which is free of deformation absorbing the expansion of lead effectively by a method wherein the tips of inner leads of every group are interlinked together by a linking piece, the linking piece is connected to a stage or a support bar with an index piece, and the linking pieces are bent. CONSTITUTION:The tips of inner leads 12 of every group are interlinked together by a linking piece 18, a slit is provided to the linking piece 18, and furthermore the interlinking piece 18 is connected to a stage 14 with index pieces 20 and 29, so that the interlinking piece 18 and the support piece 29 are bent to absorb the elongation of the inner leads 12. The interlinking piece 18 is connected to a stage 14 through the intermediary of the index piece 20, the index piece 20 is narrow in width, and the slit is provided to the interlinking piece 18, whereby the inner lead 12 can be protected against deformation. Moreover, as stress residual in a lead frame blank 10 due to a press work is eliminated through a thermal treatment, leads are prevented from being deformed due to residual stress.
申请公布号 JPH04280661(A) 申请公布日期 1992.10.06
申请号 JP19910068712 申请日期 1991.03.09
申请人 SHINKO ELECTRIC IND CO LTD 发明人 ATOBE HIDEMI
分类号 H01L23/50 主分类号 H01L23/50
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