| 摘要 |
<p>PURPOSE:To prevent lift of a component having a small thermal capacity due to attraction by solder or thermal damage of the component, and to reduce soldering steps by soldering a component group having a larger thermal capacity at once in a solder tank by applying large quantity of heat thereto, and then soldering a component group having a smaller thermal capacity than that of the group having the large capacity at once in the tank. CONSTITUTION:Components 2a, 2b of a first component group having larger thermal capacity and divided to component classes are placed on a printed board 1, and sufficient quantity of heat necessary to solder the components 2a, 2b of the first group is added to solder them. Then, after the soldering is finished, components 3, 4 of a second component group having smaller thermal capacity and divided to component classes are placed on the board 1, and sufficient quantity of heat necessary to solder the components of the second group is added to solder them.</p> |
