POSITION ALIGNMENT METHOD OF SEMICONDUCTOR WAFER

摘要

PURPOSE:To obtain a mask position alignment method which is not affected by the random position errors of chips arranged on a wafer and the position deviation errors caused by spin coat of resist, metal evaporation, etc. CONSTITUTION:An approximation formula of each chip position is deviated in which statistical processing like a method of least squares is applied to mark position detected values in the respective chips arranged on a wafer and the random error components are eliminated. Chip intervals are obtained from the values of the wafer center part of the above approximation formula. By using said intervals as scales, the subsequent mask alignment is performed.