| 摘要 |
PURPOSE:To securely resin-mold a semiconductor device with a TAB film carrier where the rear side of a semiconductor element is exposed on the outside surface of mold resin. CONSTITUTION:In a TAB mold die where a TAB film carrier 10 on which a semiconductor element 12 is mounted is clamped, the rear side of the semiconductor element 12 is exposed from the mold resin to perform resin molding, a suction sections 26, 28 which air-suck the rear side of the semiconductor element 12 at the time of resin molding is provided, and an air-sucking mechanism that passes to the said sucking section is provided. |
