| 摘要 |
PURPOSE:To effectively and easily perform a wire bonding to a hanging lead without being disturbed by flow of a solder from a die pad. CONSTITUTION:A hole 11 is provided between a bonding part 2a of a hanging lead 2 and a die pad 1 or a nonplated part 12 is provided on a surface between the part 2 and the pad 1, thereby preventing flow of a solder to the part 2a.
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