| 摘要 |
PURPOSE:To realize a surface mounting of a capacitor onto a printed board without changing the conventional structure of the capacitor and to strengthen the connection condition. CONSTITUTION:An insulated plate 2 which has through holes 4 to pass leads 3 and has an adhesion layer 5 made chiefly of thermosetting resin in a part of the bottom face is placed on the end face of a capacitor 1, and the leads 3 are bent along the bottom face of the insulated plate 2 after being passed through the through holes 4 of the insulated plate 2. This chip-type capacitor 20 is mounted on a printed board 10 first and than is heat-treated to be secured onto the printed board 10. |
