发明名称 PATTERN FORMING METHOD USING PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the photosensitive resin composition capable of forming a relief pattern high in resolution and low in elastic modulus and superior in heat resistance and electric characteristics by incorporating a polymer comprising repeating units of tetracarboxylic acid dihydrate or its derivative having siloxane group as main components. CONSTITUTION:This photosensitive resin composition comprises (A) 100 pts.wt. of the polymer comprising repeating units represented by general formula I, and (B) 0.1-200 pts.wt. of a photopolymerization initiator, a photocross-linking agent, and a sensitizer, and an organic solvent, and a base plate is coated with the composition, dried, exposed, and then, the unexposed area is developed with an aqueous basic solution. Since the resin of formula I has 2 carboxylic groups per each repeating unit, the unexposed area can be developed with the basic solution, and at that time, this unexposed area is reduced in tendency to be dissolved or swelled by the basic solution, and accordingly, the relief pattern high in resolution is obtained.
申请公布号 JPH04240856(A) 申请公布日期 1992.08.28
申请号 JP19910085689 申请日期 1991.01.25
申请人 SUMITOMO BAKELITE CO LTD 发明人 EGUCHI TOSHIMASA;TAKEDA TOSHIRO
分类号 G03F7/031;G03F7/038;G03F7/075;H01L21/027;H01L21/30 主分类号 G03F7/031
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