Electronic module resisting mechanical deformation, for a microcircuit card

摘要

The electronic module (1) is intended for a microcircuit card. It comprises a first unit (5) formed by an insulating substrate (6). The substrate carries electrodes (7), a hole (8) being formed in the substrate under each of the electrodes. The module also comprises a second unit (9) carrying an integrated circuit chip (10) and a network of conductors (13) linking the terminals (19) of the chip to the electrodes carried by the substrate. The rear face (12) of the chip and the rear face (22) of the substrate are separated by a spacer (20). The spacer (20) avoids the chip coming into contact with the substrate (6) and prevents deformations affecting the substrate being inflicted on the chip. <IMAGE>