PROCEDE DE FABRICATION DE MICROMODULES DE CIRCUIT INTEGRE ET MICROMODULE CORRESPONDANT.

摘要

The method involves pressure bonding a first strip (11) to a second strip (10) in a bonding press (8, 9), marking each strip with the pattern pitch and juxtaposing the pattern pitch markings of each strip at the time of bonding by extension of at least one strip with respect to another, and by differential heating of each of the opposing strips to cause relative movement of the two strips through expansion. Application to the manufacture of smart cards.