| 摘要 |
1,109,475. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 17 June, 1965 [20 June, 1964], No. 25675/65. Heading H1K. [Also in Division B3] A method of producing a base for a semiconductor envelope comprises the steps of soldering a welding ring to a blank having a rim corresponding with the inside or outside of the ring, and forming the ring and blank into a base with a die which supports the corresponding edges of the ring and blank to prevent flow of part of the metal in the vicinity of the soldered joint. As shown, a circular ring 2 of iron, steel or ferrochromium is soldered to a copper blank 1, Fig. 5 (not shown), and formed in a press with a die which supports corresponding edges on the outside of the ring and the blank to a depth of 0À1 mm. below the ring 2 as shown by the arrows 14, so that transverse flow of copper in the vicinity of the soldered joint is prevented at the outside of the ring 2 but permitted at the inside indicated by the arrows 15. The base formed has a hexagonal portion 5 below which is a stem 3 the end of which may be screw-threaded and the welding ring 2 has a raised portion to which an envelope may be resistance welded. In another embodiment, Figs. 7 and 8 (not shown), transverse flow of copper is restrained on the inside of the welding ring. |
