| 摘要 |
<p>PURPOSE: To provide a multi-layer circuit package having an embedded thin-film capacitor. CONSTITUTION: A circuit package 101 comprises, at least a power core 111a, a ground core 111b, a first signal core 121, a second signal core 131, and an integrally embedded thin-film capacitor 141. The integrally embedded thin-film capacitor works so as to join the first signal core to the second signal core through capacitance. A first signal core structurally comprises at least one first wire 123 terminating at least a first electrode 125, with a second signal core comprising at least a second wire 133 terminating at least a second electrode 135. At least, a part of the first electrode covers a part of the second electrode, while being made away from the second electrode by a thin film 151 of dielectric. The first electrode, the second electrode, and the dielectric thin film define an integrally embedded capacitor. A thin-film capacitor is manufactured by a thin-film formation method, while dielectric is formed by epitaxial method.</p> |
