HEAT SINK FOR ELECTRONIC COMPONENT USE

摘要

PURPOSE: To provide a copper heat sink which has cooling power much higher than an aluminum heat sink utilized currently. CONSTITUTION: In a heat sink constituted comprising a copper substrate 8, a stiffened material layer 6 bonded to the copper substrate 8 and a non-graphite hardening carbide layer 5 coating the stiffened material layer 6, a metal layer 7 is provided between the copper substrate 8 and the stiffened material layer 6 for improving adhesive property of the copper substrate 8 and the stiffened material layer 6.