发明名称 |
Surface processing method using charged or not charged particles and apparatus for carrying out the same. |
摘要 |
<p>The present invention provides a surface processing method capable of processing the surface of a work at a high processing rate without damaging the surface of the work by using, in combination, a fast processing technique using charged particles and a moderate processing technique using neutral particles that scarcely damage the surface of the work,and a surface processing apparatus suitable for carrying out the surface processing method. In carrying out a surface treatment process, the substrate is processed in a moderate surface processing mode using neutral particles when the substrate is exposed substantially to charged particles, and the substrate is processed in a fast surface processing mode using charged particles when the substrate is not exposed substantially to charged particles to achieve the surface treatment process at a high processing rate without damaging the surface of the substrate.</p> |
申请公布号 |
EP0497563(A2) |
申请公布日期 |
1992.08.05 |
申请号 |
EP19920300725 |
申请日期 |
1992.01.28 |
申请人 |
HITACHI, LTD. |
发明人 |
ONO, TETSUO;MIZUTANI, TATSUMI;SUZUKI, KEIZO |
分类号 |
H01L21/302;H01J37/32;H01L21/28;H01L21/3065;H01L21/3213 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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