发明名称 Surface processing method using charged or not charged particles and apparatus for carrying out the same.
摘要 <p>The present invention provides a surface processing method capable of processing the surface of a work at a high processing rate without damaging the surface of the work by using, in combination, a fast processing technique using charged particles and a moderate processing technique using neutral particles that scarcely damage the surface of the work,and a surface processing apparatus suitable for carrying out the surface processing method. In carrying out a surface treatment process, the substrate is processed in a moderate surface processing mode using neutral particles when the substrate is exposed substantially to charged particles, and the substrate is processed in a fast surface processing mode using charged particles when the substrate is not exposed substantially to charged particles to achieve the surface treatment process at a high processing rate without damaging the surface of the substrate.</p>
申请公布号 EP0497563(A2) 申请公布日期 1992.08.05
申请号 EP19920300725 申请日期 1992.01.28
申请人 HITACHI, LTD. 发明人 ONO, TETSUO;MIZUTANI, TATSUMI;SUZUKI, KEIZO
分类号 H01L21/302;H01J37/32;H01L21/28;H01L21/3065;H01L21/3213 主分类号 H01L21/302
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