| 摘要 |
<p>PURPOSE:To form a dense thin film fine line in which the number of films to be laminated can remarkably be increased by specifying the components of a conductive composition and their ratios. CONSTITUTION:The composition for forming a palladium or palladium alloy thin film in this invention is as follows. Namely, it is a one contg., simple grain dispersed ultrafine powder of palladium or a palladium alloy having 30 to 1000Angstrom average grain size by 5 to 70wt.% as metal, simple grain dispersed ultrafine powder of rhodium or iridium having 30 to 1000Angstrom average grain size by 0.005 to 1.0wt.% as metal, arbitrarily contg. simple grain dispersed ultrafine powder of gold having 30 to 1000Angstrom average grain size by 2.5 to 35wt.% as metal and furthermore 0.5 to 10wt.% of one or more kinds among lead, boron, silicon, bismuth, vanadium, Ti and Ba having the same grain size.</p> |
