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发明名称	WAFER SUPPORT DEVICE
摘要
申请公布号	JPH04207023(A)	申请公布日期	1992.07.29
申请号	JP19900339640	申请日期	1990.11.30
申请人	DISCO ABRASIVE SYST LTD	发明人	SEKIYA SHINJI
分类号	C03B20/00;H01L21/22	主分类号	C03B20/00
代理机构		代理人
主权项
地址

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