WETTING OF LOW MELTING TEMPERATURE SOLDERS BY SURFACE ACTIVE ADDITIONS

摘要

IMPROVED WETTING OF LOW MELTING TEMPERATURE SOLDERS BY SURFACE ACTIVE ADDITIONS A lead based alloy is modified by adding thereto a surfactant consisting of about 0.01 to 0.5 weight percent tellurium, about 0.01 to 0.5 weight percent selenium, about 0.01. to 0.5 weight percent selenium plus about 0.1-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at lease about 103.degree.C/sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.