| 摘要 |
<p>PURPOSE:To improve the mounting accuracy of a weight by providing position determining guide lines for the weight of a semiconductor sensor. CONSTITUTION:A sensor chip is supported on one end of a package through a stage in a cantilever pattern. An acceleration detecting weight is attached on the sensor chip at the end part of the above described stage at the opposite side in a semiconductor acceleration sensor. In this semiconductor acceleration sensor, position determining guide lines with respect to the above described sensor chip are provided on the surface of the above described weight. When the position is determined by observing the guide lines provided on the surface of the weight 8, the highly accurate assembling of members can be performed.</p> |
