| 摘要 |
A protective heat sink for an electronic component dissipates heat generated thereby. A first heat conductive member is mounted to the top side of the electronic component. A protective cap having an aperture formed therein is mounted on the printed circuit board such that it extends over the electronic component and the first heat conductive member. A second heat conductive member is mounted to the first heat conductive member and extends through the aperture in the cap such that heat generated by the electronic component is transmitted to the first heat conductive member and then dissipated to the environment by the second heat conductive member.
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