| 摘要 |
PCT No. PCT/JP86/00364 Sec. 371 Date Feb. 19, 1987 Sec. 102(e) Date Feb. 19, 1987 PCT Filed Jul. 16, 1986 PCT Pub. No. WO87/00686 PCT Pub. Date Jan. 29, 1987.A stack layer structure is formed wherein solderable metal layers are provided at least at two ends thereof, and at least a metal layer for preventing the diffusion of solder is inserted between the two metal layers. In an interboard connection terminal and a method of manufacturing the same, a pair of solder bumps are fixed to be in contact with the two surfaces of the resultant stack layer structure. |
