INNER LEAD BOND FOR IC CHIP,申请号JP19900324334-传众专利搜索

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发明名称	INNER LEAD BOND FOR IC CHIP
摘要
申请公布号	JPH04192536(A)	申请公布日期	1992.07.10
申请号	JP19900324334	申请日期	1990.11.27
申请人	TOSHIBA CORP	发明人	SHIBATA KOJI
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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