| 摘要 |
PURPOSE:To prevent a wire from being short-circuited to an adjacent inner lead at wire-bonding by a method wherein an insulating frame provided with through-holes corresponding to inner leads is mounted on the tips of the inner leads. CONSTITUTION:An insulating frame 3a of polyimide film or the like provided with through-holes corresponding to inner leads 2 is mounted on the tips of the inner leads 2. The side of the through-hole 4 is as large as the width of the inner lead 2. By this setup, a wire is bonded to the part of the lead 2 exposed at the through-hole 4, whereby a wire can be prevented from being short- circuited to an adjacent inner lead at wire-bonding even if a lead frame where the finely patterned inner leads are provided small in pitch is used. |
