DIRECT MICROCIRCUIT DECOUPLING

摘要

Decoupling apparatus 10 for a microcircuit 12 provides for a custom capacitor 20 to be placed directly on the passivated upper surface 11 of the integrated circuit or alternatively to be placed directly under the integrated circuit. In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface.