发明名称 SUPPORTING BASE OF WIRE-BONDING SUBSTRATE
摘要 PURPOSE:To enhance the operating characteristics of the title supporting base by a method wherein a circular oscillating plate is fixed on a plurality of circular piezoelectric elements concentrically fixed on a base and then a stage is freely rotatably mounted on the plate to be rotated by the electrostriction effect. CONSTITUTION:A work (a) is mounted on the stage 8 of an XY table 16 of a wire-bonding device. In order to wire-bond the work (a), the stage 8 is rotated clockwise or counterclockwise to be aligned if necessary by the switch manipulation or the command of a control system. That is, when the electrode of an inner piezoelectric element 2 is impressed with specific frequency voltage, respective oscillating members 6 vibrate vertically to lift up the stage 8 so that the surface of the distorted members 6 may be ellipticaly moved making the thrust to the front end to rotate the stage 8 clockwise. On the other hand, when the electrode of an outer piezoelectric element 3 is impressed with the specific frequency voltage, the other oscillating members 7 vibrate vertically to rotate the stage counterclockwise.
申请公布号 JPH04184948(A) 申请公布日期 1992.07.01
申请号 JP19900314740 申请日期 1990.11.20
申请人 NIHON DENSO KOUGIYOU KK 发明人 MURAKOSHI HIDEFUMI
分类号 H01L21/60;H01L41/09 主分类号 H01L21/60
代理机构 代理人
主权项
地址