| 摘要 |
PURPOSE:To obtain the subject molded product improved in the thermal resistance and chemical resistance without the deterioration of the dielectric characteristics and strength by melt-molding a specific allyl group-containing polyphenylene ether at a temperature near the glass transition temperature of the polymer and subsequently subjecting the molded product to a thermal treatment at a high temperature. CONSTITUTION:An allyl-containing polyphenylene ether of formula I (Q is allyl, methyl; R is H, halogen, primary or secondary alkyl, aryl, haloalkyl, aminoalkyl, hydrocarbon oxy, or halohydrocarbon oxy in which the halogen and the oxygen are bonded to at least two carbon atoms; X, Y are satisfied with inequalities II and III) is melt-molded in a temperature range of the glass transition temperature + or -50 deg.C, followed by heating the molded product at a temperature of >=250 deg.C to form crosslinking bonds in the polyphenylene ether molecule, thus providing the objective crosslinked molded product. |
