| 摘要 |
PURPOSE:To obtain the package for microwave IC having satisfactory isolation between input/output ports by shielding a space for mounting an IC chip by a grounding conductor, partitioning the space in the direction of serially connecting high frequency IC and forming plural spaces for mounting IC chips. CONSTITUTION:Both cavities 2a and 2b are partitioned by a grounding conductor 3A and shielded. Then, plural high frequency IC chips 5a and 5b are soldered to the respective cavities 2a and 2b and fixed by using an adhesive agent or any other method, and DC and RF terminals are connected by using wire bond, ribbon bond or any other method. Thus, since the grounding conductor 3A is interposed between an input side feed through 4a and an output side feed through 4a, the isolation between input and output is improved. |
