发明名称 SEMICONDUCTOR PACKAGE
摘要 PURPOSE:To prevent the damage to sealing glass due to lead forming by providing a reinforcement means for stiffening lead portions to be in contact with the sealing glass. CONSTITUTION:Reinforcement means 24 is provided for stiffening parts of leads 14 coming into contact with sealing glass 26. Therefore, the leads are hard to bend on the reinforcement means 24, and this prevent the bending force from concentrating on the sealing glass. Consequently, even when glass bonds are thin and conical, they are not likely to crack or fraction. Thereby, when the leads are bent, the sealing glass can be prevented from damage.
申请公布号 JPH04181758(A) 申请公布日期 1992.06.29
申请号 JP19900308638 申请日期 1990.11.16
申请人 FUJITSU LTD 发明人 WATABE SHINICHI
分类号 H01L23/12;H01L23/48 主分类号 H01L23/12
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