发明名称 BONDING OF THERMOSET COMPOSITE STRUCTURES
摘要 Bonding of Thermoset Composite Structures A pair of thermoset composite structures (19,19') are bonded together by a pair of adhesive strips (10,10'). An adhesive strip (10) is comprised of a layer of semi-crystalline thermoplastic material (12), a layer of amorphous thermoplastic material (14), a layer of dry fiber reinforcement (16) partially embedded in the layer of amorphous thermoplastic material (14), and a layer of thermosetting resin (18) covering the exposed fibers of the dry fiber reinforcement. An adhesive strip is bonded to the bonding surface (20) of the structure (19) during the curing process for the thermoset composite structure. A resistance heating element is placed between the bonding surfaces (20,20'), the bonding surfaces (20,20') are pressed together, and electrical energy is passed through the heating element (24) to heat the joint and fuse the thermoplastic adhesive layers together. The dry fiber reinforcement (16) forms a mechanical lock between the cumulative layer of thermoplastic adhesive (32) and the thermosetting structures (19,19') to provide the bond strength. S-4297 - 19
申请公布号 CA2052427(A1) 申请公布日期 1992.06.18
申请号 CA19912052427 申请日期 1991.09.26
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 JACARUSO, GARY J.;DAVIS, GEOFFREY C.;MCINTIRE, ALLEN J.
分类号 B29C65/02;B29C65/34;B29K101/10;B29K105/06;B32B27/12;C08J5/12;C09J5/06 主分类号 B29C65/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利