发明名称 PREPREG AND MULTI-LAYER CIRCUIT BOARD
摘要 PURPOSE:To obtain the subject prepreg for electronic equipment, etc., sufficiently workable at low temperature under low pressure in bonding and capable of shortening the working time by successively applying a tetrafluoroethylene- hexafluoropropylene copolymer layer, etc., on a cloth substrate. CONSTITUTION:The objective prepreg 7 is produced by forming a layer 2 of a tetrafluoroethylene-hexafluoropropylene copolymer (abbreviated to FEP) or a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer on a cloth substrate 1 and applying a polytetrafluoroethylene layer 3 and an FEP layer 4 on the copolymer layer 2.
申请公布号 JPH04168127(A) 申请公布日期 1992.06.16
申请号 JP19900296730 申请日期 1990.10.31
申请人 NITTO DENKO CORP 发明人 SHIBAGAKI KAZUYOSHI;IWASAKI NAOTO;MOTOGAMI MITSURU
分类号 C08J5/04;C08L27/12;H01B3/40;H05K1/03 主分类号 C08J5/04
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