| 摘要 |
PURPOSE:To avoid the production of bonding wire ghost image by a method wherein the title solid-state image pick-up device is structured so that the bonding wire may be pulled out of the electrode pad for signal input.output of a solid-state image pick-up chip making an angle of at most 35 deg. with an image pick-up surface. CONSTITUTION:An aluminum bonding wire 8 is pulled out of the electrode pad 9 for signal input.output of a solid-state image pick-up chip 7 making an angle of about 30 deg. with an image pick-up surface 5. At this time, the incident angle of peripheral beams 3 from an ordinary lens is to make an angle not exceeding 15 deg. with vertically incoming near axle beams 1 meeting the worst requirements. Since the reflected beams 3-1, 3-2 on the bonding wire 8 meeting such requirements are reflected upward making an angle of 15 deg. with the image pick-up surface 5 even in the case of the lens peripheral beams 22 meeting the worst requirements, said reflected beams go out of the title solid-state image pick-up device without coming-in the image pick-up surface 5 thereby producing no ghost image. Through these procedures, the production of bonding wire ghaust image can be avoided. |
