发明名称 |
Composite flanged ceramic package for electronic devices |
摘要 |
An improved ceramic-based package for electronic devices having a composite flange for heat dissipation comprising a layer of heat conducting metal having a thermal coefficient of expansion appreciably different from that of the base secured to the base and a second layer of metal secured to the first layer having a thermal coefficient of expansion approximately equal to that of the ceramic. In a preferred embodiment, the first layer is copper, and the second is molybdenum.
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申请公布号 |
US4227036(A) |
申请公布日期 |
1980.10.07 |
申请号 |
US19780943487 |
申请日期 |
1978.09.18 |
申请人 |
MICROWAVE SEMICONDUCTOR CORP. |
发明人 |
FITZGERALD, WILLIAM |
分类号 |
H01L23/057;H01L23/08;H01L23/36;H01L23/373;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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