| 摘要 |
<p>PURPOSE:To bring a probe stylus of any shape into satisfactory contact with a pad by adding a horizontal operation to the vertical operation of a wafer holding stage of a wafer probe at the same time as a vertical direction. CONSTITUTION:After a stage 4 is raised and a wafer 3 is brought into contact with a probe stylus 2 on a probe card 1, the stage 4 is raised and simultaneously moved in a horizontal direction. Its moving speed, moving distance, etc., are suitably set in response to the material, the shape, etc., of the stylus 2 and the material, shape, etc., of a pad 5. Thus, even if the stylus 2 of any shape is used, the contact of the stylus 2 with the pad 5 can be performed in a cutout state to obtain an excellent contact state.</p> |
