| 摘要 |
PURPOSE:To enable chip components and the like to be fully soldered onto a printed board by a method wherein the printed board is transferred as it is tilted upward, and the components are soldered with solder jetted from a jet nozzle arranged at an angle to a transfer direction. CONSTITUTION:A jet nozzle 11 is provided under a transfer route where a printed board 12 is transferred by a transfer body 17 as it is tilted upward, where the nozzle 11 is arranged in such a manner that the lengthwise direction of the nozzle 11 is set at an angle to the transfer direction of the printed board 12 or the low level side of a nozzle opening 11a is located on an upstream side of the board transfer direction and the high level side of the nozzle opening 11a is located on a downstream side of the board transfer direction, and the printed board 12 is arranged coming into contact with a solder jet 16. Solder jetted from the nozzle opening 11a has a resultant flow upsilon0. composed of a flow upsilon1 vertical to the lengthwise direction of the nozzle opening 11a and a flow upsilon2 from the high level side toward the low level side of the nozzle opening 11a. When the printed board approaches to the nozzle opening 11a along the direction of an arrow, the conductor side of the printed board 11a is successively brought into contact with the solder jet 16 from a side (a) toward a side (b) to be soldered. |
