| 摘要 |
PURPOSE:To prevent a bonding agent from crawling up on the side faces of a semiconductor device, by forming grooves on the surface of a base board on which the semiconductor device is bond-fastened, and by making the volumes of the grooves greater than the volume of the excessive bonding agent, and further, by so providing the edge parts of the semiconductor device that they are opposed to the grooves respectively. CONSTITUTION:On a base board 21, a semiconductor device 22 is bond-fastened with a bonding agent. On the top face of the base board 21, grooves 25 are formed along the side edge parts 22a of the under face of the semiconductor device 22. The grooves 25 are so preset that every one of the grooves 25 has the size and shape of the side edge part 22a being opposed to the middle of the width of the groove 25, and that the grooves 25 have the larger volumes than the volume of the excessive bonding agent 23 of a fed bonding agent, which has come excessive after bond-fastening the device 22. Thereafter, the excessive portion of the bonding agent which is used for bond-fastening the semiconductor device 22 on the base board 21, flows into the grooves 25. Thereby, there is no possibility of the bonding agent crawling up on the side faces of the semiconductor device 22. |
