| 摘要 |
<p>PURPOSE:To surely and easily connect a semiconductor chip with a substrate and obtain high reliability, by a method wherein, after solder protruding parts composed of solder are previously formed on electrode parts, solder bumps and the solder protruding parts are connected by heating and fusing. CONSTITUTION:Flux is spread on the whole surface of a solder dam layer 3 and protruding parts 6, A semiconductor chip 5 is temporarily fixed on the region of the solder protruding parts 6 or at the position of the solder dam layer 3, by using a face down bonding equipment. Solder bump connection electrode parts 2 and solder bumps 4 are electrically connected by a reflow process. When the solder bumps 4 are temporarily fixed at a position on the solder dam layer 3, on account of the irregularity of mounting precision of the bonding equipment, the solder bumps are easily absorbed in the solder protruding parts 6, because the solder protruding parts 6 are formed on the solder bump connection electrode parts 2. Thereby self-alignment effect is improved, and an ideal shape of solder bump connection (barrel shape) is obtained, so that the semiconductor chip 5 can be easily connected with the substrate 1 and high reliability is obtained.</p> |
