| 摘要 |
<p>PURPOSE:To make it possible to manufacture a small package for microwave semiconductor device by housing a bias resistance circuit boards containing a plurality of resistors and bypass capacitors in the package. CONSTITUTION:To bias resistance circuit boards 3A-3C and 4A-4C where a plurality of thin film resistors are prepared bypass capacitors 7 and 8 are mounted, and further thus board and IC chips 2A-2F are mounted in the package 1 at a time. After that, bias resistance circuit boards 3A-4A are interconnected and bonding wire work is carried out between IC chips 2A-2F, bias resistance circuits boards, and lead terminals 5-6. Furthermore, for selection of bias resistance, a high frequency measuring jig or the like is used to evaluate the high frequency characteristic to determine the optimum bias in advance.</p> |
