Microchip with electrical element in sealed cavity.

摘要

A method of producing a microchip (110) having at least a portion of an electrical circuit element (144) contained within a hermetically sealed enclosure comprises the steps of: forming a cavity (116) in a first substrate assembly (112), forming an electrical circuit element (144) and sealing ring (138) from a film applied to a first surface portion (134) of a second substrate assembly, positioning the cavity opposite the first surface portion of the second substrate assembly with the sealing ring located in circumscribing relationship with the cavity, and bonding the sealing ring to the first substrate assembly.