发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To enable pads formed on a semiconductor substrate to be enhanced in number and remarkably improved in utilization factor by a method wherein input-output cells are provided to both the front and the rear of the semiconductor substrate. CONSTITUTION:A semi-custom semiconductor device is provided with pads 103 of metal or semiconductor, input-output cells 104 located adjacent to the pads 103, and through-grooves 105 provided onto the front and the rear of a substrate 102, where inner cells 101 located on the front of the semiconductor substrate 102 and the input-output cells 104 located on the rear of the substrate 102 are connected with aluminum wirings 301 through the through-grooves 105. The data of the through-grooves 105 are inputted when a mask is formed. The aluminum wirings 301 which connect the cells on the front and the input- output cells on the rear together are formed of optional conductive material.</p>
申请公布号 JPH04119650(A) 申请公布日期 1992.04.21
申请号 JP19900240586 申请日期 1990.09.11
申请人 SEIKO EPSON CORP 发明人 TATEISHI AKIHIKO
分类号 H01L21/60;H01L21/82 主分类号 H01L21/60
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