发明名称 PROCESSING METHOD FOR SEALED LEAD FRAME
摘要 <p>PURPOSE:To form a highly precise lead by performing the molding of a lead in a temperature atmosphere higher than or equal to the glass transition point of resin. CONSTITUTION:When the lead of a sealed lead frame is subjected to molding, the temperature atmosphere is set higher than or equal to the glass transition point of resin. Thereby deformation is scarcely generated in the lead frame, so that the dimensional precision from a jig reference hole to a dam bar or a lead is not decreased. A processing equipment 5 for molding a lead constituted of a frame loader 51 and a processing metal mold 52 is arranged in a high temperature tank 6, into which hot air is introduced from a heat source, thereby controlling the temperature atmosphere of the tank in a specified state. As the result, the deformation of a lead frame 10 is scarcely generated in a sealed lead frame 1 on a frame loader 51, so that error of dimensional precision is not present when the lead frame is sent in succession for the processing mold 52 in accordance with the jig holes 14, 14, so that the lead can be subjected to molding with desired precision.</p>
申请公布号 JPH04116856(A) 申请公布日期 1992.04.17
申请号 JP19900236388 申请日期 1990.09.06
申请人 SONY CORP 发明人 SAITO TAKASHI;OTSUKA YASUSHI;MURAYAMA TOSHIHIRO
分类号 H01L23/50 主分类号 H01L23/50
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