发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To eliminate necessity of connecting by bonding wires, to reduce its cost and to shorten a term by providing a structure for forming a resistor on the sidewall of an opening of a ceramic board. CONSTITUTION:A first resistor 22A connected at one end to a ground wiring and at the other to a metallized pattern wiring 21A is provided on the sidewall of an opening of a first ceramic board 2A. A second resistor 22B connected at one end to a metallized wiring and a power wiring 23B and at the other to a metallized pattern wiring 21A, and a lead terminal 3 for connecting to the wiring 21A are provided on the sidewall of the opening of a framelike second ceramic board 2B formed with a metallized power wiring 23B of a second power wiring on its upper surface. Thus, necessity of connecting between the resistors 22A, 22B and the wirings 21A, 23B is eliminated, its cost is reduced, and its term is shortened.</p>
申请公布号 JPH04116964(A) 申请公布日期 1992.04.17
申请号 JP19900237424 申请日期 1990.09.07
申请人 NEC CORP 发明人 UCHIDA HIROYUKI
分类号 H01L25/00 主分类号 H01L25/00
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