Ceramic packages and ceramic wiring board.

摘要

A ceramic package for containing a semiconductor chip (3) including a heat radiating plate (1) and a base plate for wiring, and a ceramic package for containing a semi-conductor chip including a ceramic board (4), a ceramic cap (9) and a metal lead frame; in these packages the heat radiating plate and the ceramic board are made of silicon nitride sintering body. And, a ceramic wiring board, in which a ceramic used as a material of the ceramic base plate is made of polycrystal body of silicon nitride characterized in that the number of grain boundaries of silicon nitride per 10 mu m of a straight line drawn in an arbitrary section of the polycrystal body is 20 or fewer.