| 摘要 |
PURPOSE:To perform high integration, high speed and high performance by providing a second type board having a function for connecting a plurality of first type boards each having independent system function therebetween, and incorporating a semiconductor element or a sensor together with wirings in the second type board. CONSTITUTION:A wafer containing silicon as a main content is, for example, used as a mounting board 1 of a second type board. The silicon wafer is used to accurately form an element, wirings 3 or a sensor by using a normal silicon technology. 0 ions are implanted in a high concentration in the silicon board 13, heat treated to form an SiO2 film 2 in the board, and a silicon layer 11 is provided on a surface layer. The layer 11 is made of single crystal, a diffused region is suitably formed therein, a gate insulating film, a polysilicon gate electrode, etc., are formed thereon, and a semiconductor device such as a memory, etc., is formed. A CPU, a memory, etc., are formed on the second type board, and are used for a high class microcomputer with a display for visualizing a calculated result, a logic output to be output, on display means such as a liquid crystal display, etc., formed on the first type board. |
