| 摘要 |
<p>PURPOSE:To provide a lead frame having high heat resistance, high oxidation resistance without retaining resin on the surface of a mold near its resin pouring inlet by coating a periphery except outer leads with medicine such as heat resistant nonoxidative mold release agent, etc. CONSTITUTION:The periphery 2 of a lead frame 1 made of iron-nickel alloy, copper alloy is coated with medicine such as heat resistant nonoxidative mold release agent, etc. Gold or silver plating 5 is provided 1.5-3mum thick on the ends of a die pad 3 and inner leads 4 at front surface side of the frame 1. A semiconductor chip 7 is adhered and secured on the pad 3 of the frame 1. Then, bonding pads 9 on this chip are connected to the plating 5 of the leads 4 by a wire bonding method, and resin-sealed in a resin-sealing mold. Accordingly, even if resin having high viscosity is used, no resin remains on the frame near the resin pouring inlet of the mold, and the mold is not damaged when using at a later data for bending the leads.</p> |
